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  IEC 60749-23 : 1.1

  IEC 60749-23 : 1.1 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE International Electrotechnical Committee

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  IEC 60749-22 : 1.0

  IEC 60749-22 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH International Electrotechnical Committee

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  IEC 60749-21 : 2.0

  IEC 60749-21 : 2.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY International Electrotechnical Committee

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  IEC 60749-20-1 : 1.0

  IEC 60749-20-1 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT International...

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  IEC 60749-20 : 2.0

  IEC 60749-20 : 2.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT International Electrotechnical Committee ...

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  IEC 60749-2 : 1.0

  IEC 60749-2 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 2: LOW AIR PRESSURE International Electrotechnical Committee

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  IEC 60749-19 : 1.1

  IEC 60749-19 : 1.1 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH International Electrotechnical Committee

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  IEC 60749-18 : 1.0

  IEC 60749-18 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 18: IONIZING RADIATION (TOTAL DOSE) International Electrotechnical Committee

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  IEC 60749-17 : 1.0

  IEC 60749-17 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 17: NEUTRON IRRADIATION International Electrotechnical Committee

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  IEC 60749-16 : 1.0

  IEC 60749-16 : 1.0 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND) International Electrotechnical Committee

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