IEC 60749-21 : 2.0

Table of Contents

FOREWORD<br>1 Scope<br>2 Normative references<br>3 Test apparatus<br>4 Procedure <br>5 Summary <br>Bibliography

Abstract

Covers a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47
Supersedes	IEC PAS 62173 : 1.0