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  IEC 60191-6-19 : 1.0

  IEC 60191-6-19 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE International Electrotechnical Committee ...

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  IEC 60191-6-18 : 1.0

  IEC 60191-6-18 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA) International...

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  IEC 60191-6-17 : 1.0

  IEC 60191-6-17 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY...

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  IEC 60191-6-16 : 1.0

  IEC 60191-6-16 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA International Electrotechnical Committee

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  IEC 60191-6-13 : 2.0

  IEC 60191-6-13 : 2.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) International Electrotechnical...

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  IEC 60191-6-12 : 2.0

  IEC 60191-6-12 : 2.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)

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  IEC 60191-6-10 : 1.0

  IEC 60191-6-10 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-10: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DIMENSIONS OF P-VSON International Electrotechnical...

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  IEC 60191-6-1 : 1.0

  IEC 60191-6-1 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

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  IEC 60191-6 : 3.0

  IEC 60191-6 : 3.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES International Electrotechnical Committee ...

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  IEC 60191-5 : 2.0

  IEC 60191-5 : 2.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - RECOMMENDATIONS APPLYING TO INTEGRATED CIRCUIT PACKAGES USING TAPE AUTOMATED BONDING (TAB) International Electrotechnical Committee

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