MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - RECOMMENDATIONS APPLYING TO INTEGRATED CIRCUIT PACKAGES USING TAPE AUTOMATED BONDING (TAB)
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Terms and definitions<br>3 Description of tape automated bonding (TAB)<br>4 Dimensional requirements<br> 4.1 Film format<br> 4.2 Alignment holes<br> 4.3 Body size<br> 4.4 Test pad patterns<br> 4.5 Outer lead patterns<br> 4.6 Maximum lead count<br>5 Variation codes<br>6 Requirements for inner and outer lead bonding (ILB and <br> OLB)<br>Figures<br>Tables<br>Notes to figures and tables<br>Annexes<br>A Summary of recommended TAB package configurations <br> (super format)<br>B Summary of recommended TAB package configurations<br> (wide format)<br>C Outer lead numbering<br>D Test pad numbering
Provides recommendations applicable to integrated circuits in packages which use tape automated bonding (TAB) as the main component for structural and interconnection functions. Does not apply to the finished component supplied by a manufacturer to a user and does not specify requirements pertaining to the IC to tape interface (the inner lead bond or ILB).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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