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  IEC 60192 : 3.0

  IEC 60192 : 3.0 LOW-PRESSURE SODIUM VAPOUR LAMPS - PERFORMANCE SPECIFICATIONS International Electrotechnical Committee

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  IEC 60191-6-8 : 1.0

  IEC 60191-6-8 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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  IEC 60191-6-6 : 1.0

  IEC 60191-6-6 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)

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  IEC 60191-6-5 : 1.0

  IEC 60191-6-5 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)

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  IEC 60191-6-4 : 1.0

  IEC 60191-6-4 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

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  IEC 60191-6-3 : 1.0

  IEC 60191-6-3 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)

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  IEC 60191-6-22 : 1ED 2012

  IEC 60191-6-22 : 1ED 2012 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON...

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  IEC 60191-6-21 : 1.0

  IEC 60191-6-21 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) ...

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  IEC 60191-6-20 : 1.0

  IEC 60191-6-20 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ) ...

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  IEC 60191-6-2 : 1.0

  IEC 60191-6-2 : 1.0 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES ...

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