Home>IEC 60191-6-22 : 1ED 2012

IEC 60191-6-22 : 1ED 2012

IEC 60191-6-22 : 1ED 2012

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions
8 Combination list of D, E, M[D], and M[E]
Bibliography

Abstract

Specifies the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47

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