IECThere are 7584 products.

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  IEC 62047-26 : 1ED 2016

  IEC 62047-26 : 1ED 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 26: DESCRIPTION AND MEASUREMENT METHODS FOR MICRO TRENCH AND NEEDLE STRUCTURES International Electrotechnical Committee

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  IEC 62047-25 : 1ED 2016

  IEC 62047-25 : 1ED 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA International Electrotechnical...

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  IEC 62047-22 : 1ED 2014

  IEC 62047-22 : 1ED 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES International Electrotechnical Committee ...

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  IEC 62047-21 : 1ED 2014

  IEC 62047-21 : 1ED 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS International Electrotechnical Committee

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  IEC 62047-20 : 1ED 2014

  IEC 62047-20 : 1ED 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES International Electrotechnical Committee

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  IEC 62047-2 : 1.0

  IEC 62047-2 : 1.0 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS International Electrotechnical Committee

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  IEC 62047-19 : 1ED 2013

  IEC 62047-19 : 1ED 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 19: ELECTRONIC COMPASSES International Electrotechnical Committee

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  IEC 62047-18 : 1ED 2013

  IEC 62047-18 : 1ED 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS International Electrotechnical Committee

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  IEC 62047-17 : 1ED 2015

  IEC 62047-17 : 1ED 2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS International Electrotechnical Committee

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  IEC 62047-16 : 1ED 2015

  IEC 62047-16 : 1ED 2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS International Electrotechnical...

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