SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
4.1 Method of gripping
4.2 Method of loading
4.3 Speed of testing
4.4 Force measurement
4.5 Elongation measurement
4.6 Stress-strain curve
4.7 Environment control
5 Test piece
5.1 General
5.2 Plane shape of test piece
5.3 Test piece thickness
5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Defines the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 [mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
