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IEC 60317-38 : 2.0 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIRES - PART 38: POLYESTER OR POLYESTERIMIDE OVERCOATED WITH POLYAMIDE-IMIDE, ENAMELLED ROUND COPPER WIRE, CLASS 200, WITH A BONDING LAYER International Electrotechnical...
IEC 60317-37 Ed. 2.1 En:2024 Specifications for particular types of winding wires - Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer CONSOLIDATED EDITION standard by
IEC 60317-37 Amd.1 Ed. 2.0 B:2024 Amendment 1 - Specifications For Particular Types Of Winding Wires - Part 37: Polyesterimide Enamelled Round Copper Wire, Class 180, With A Bonding Layer Amendment by
IEC 60317-37 : 2.0 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIRES - PART 37: POLYESTERIMIDE ENAMELLED ROUND COPPER WIRE, CLASS 180, WITH A BONDING LAYER International Electrotechnical Committee
IEC 60317-36 Ed. 2.2 En:2024 Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer CONSOLIDATED EDITION standard by
IEC 60317-36 Amd.2 Ed. 2.0 B:2024 Amendment 2 - Specifications For Particular Types Of Winding Wires - Part 36: Solderable Polyesterimide Enamelled Round Copper Wire, Class 180, With A Bonding Layer Amendment by
IEC 60317-36 : 2.0 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIRES - PART 36: SOLDERABLE POLYESTERIMIDE ENAMELLED ROUND COPPER WIRE, CLASS 180, WITH A BONDING LAYER International Electrotechnical Committee
IEC 60317-35 Ed. 2.2 En:2024 Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer CONSOLIDATED EDITION standard by
IEC 60317-35 Amd.2 Ed. 2.0 B:2024 Amendment 2 - Specifications For Particular Types Of Winding Wires - Part 35: Solderable Polyurethane Enamelled Round Copper Wire, Class 155, With A Bonding Layer Amendment by
IEC 60317-35 : 2.0 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIRES - PART 35: SOLDERABLE POLYURETHANE ENAMELLED ROUND COPPER WIRE, CLASS 155, WITH A BONDING LAYER International Electrotechnical Committee
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