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  IEC 61189-3 : 2.0

  IEC 61189-3 : 2.0 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) International Electrotechnical Committee ...

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  IEC 61189-2-808 Ed. 1.0 b:2024

  IEC 61189-2-808 Ed. 1.0 b:2024 Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies - Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method standard by...

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  IEC 61189-2-805 Ed. 1.0 b:2024

  IEC 61189-2-805 Ed. 1.0 b:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-805: X/Y CTE test for thin base materials by TMA standard by

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  IEC 61189-2-804 Ed. 1.0 b:2023

  IEC 61189-2-804 Ed. 1.0 b:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300 standard by...

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  IEC 61189-2-803 Ed. 1.0 b:2023

  IEC 61189-2-803 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

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  IEC 61189-2-801 Ed. 1.0 b:2023

  IEC 61189-2-801 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials standard by

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  IEC 61189-2-721 : 1ED 2015

  IEC 61189-2-721 : 1ED 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-721: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MEASUREMENT OF RELATIVE PERMITTIVITY AND LOSS TANGENT FOR COPPER CLAD LAMINATE AT...

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  IEC 61189-2-720 Ed. 1.0 b:2024

  IEC 61189-2-720 Ed. 1.0 b:2024 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

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  IEC 61189-2-630 : 1ED 2018

  IEC 61189-2-630 : 1ED 2018 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-630: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MOISTURE ABSORPTION AFTER PRESSURE VESSEL CONDITIONING

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  IEC 61189-2 : 2.0

  IEC 61189-2 : 2.0 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES International Electrotechnical Committee ...

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