IECThere are 7584 products.

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  IEC 61192-2 : 1.0

  IEC 61192-2 : 1.0 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES International Electrotechnical Committee

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  IEC 61192-1 : 1.0

  IEC 61192-1 : 1.0 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL International Electrotechnical Committee

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  IEC 61191-6 : 1.0

  IEC 61191-6 : 1.0 PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD International Electrotechnical Committee

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  IEC 61191-4 : 2.0

  IEC 61191-4 : 2.0 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES International Electrotechnical Committee

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  IEC 61191-3 : 2.0

  IEC 61191-3 : 2.0 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES International Electrotechnical Committee

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  IEC 61191-2 : 3.0

  IEC 61191-2 : 3.0 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES International Electrotechnical Committee

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  IEC 61191-1:2018

  IEC 61191-1:2018 Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies International Electrotechnical Committee ...

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  IEC 61191-1 : 2.0

  IEC 61191-1 : 2.0 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES International Electrotechnical Committee ...

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  IEC 61190-1-3 : 3.0

  IEC 61190-1-3 : 3.0 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS International Electrotechnical...

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  IEC 61190-1-2 : 3.0

  IEC 61190-1-2 : 3.0 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY International Electrotechnical Committee

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