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  IEC 62047-47 Ed. 1.0 en:2024

  IEC 62047-47 Ed. 1.0 en:2024 Semiconductor devices – Micro-electromechanical devices – Part 47: Silicon based MEMS fabrication technology – Measurement method of bending strength of microstructures standard by

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  IEC 62047-44 Ed. 1.0 en:2024

  IEC 62047-44 Ed. 1.0 en:2024 Semiconductor devices – Micro-electromechanical devices – Part 44: Test methods for dynamic performances of MEMS resonant electricfield- sensitive devices standard by

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  IEC 62047-43 Ed. 1.0 en:2024

  IEC 62047-43 Ed. 1.0 en:2024 Semiconductor devices – Micro-electromechanical devices – Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices standard by...

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  IEC 62047-4 : 1.0

  IEC 62047-4 : 1.0 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS International Electrotechnical Committee

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  IEC 62047-32:2019

  IEC 62047-32:2019 Semiconductor devices – Micro-electromechanical devices – Part 32: Test method for the nonlinear vibration of MEMS resonators International Electrotechnical Committee

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  IEC 62047-30 : 1ED 2017

  IEC 62047-30 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 30: MEASUREMENT METHODS OF ELECTRO-MECHANICAL CONVERSION CHARACTERISTICS OF MEMS PIEZOELECTRIC THIN FILM International Electrotechnical Committee ...

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  IEC 62047-3 : 1.0

  IEC 62047-3 : 1.0 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING International Electrotechnical Committee

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  IEC 62047-29 : 1ED 2017

  IEC 62047-29 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 29: ELECTROMECHANICAL RELAXATION TEST METHOD FOR FREESTANDING CONDUCTIVE THIN-FILMS UNDER ROOM TEMPERATURE International Electrotechnical Committee ...

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  IEC 62047-28 : 1ED 2017

  IEC 62047-28 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 28: PERFORMANCE TESTING METHOD OF VIBRATION-DRIVEN MEMS ELECTRET ENERGY HARVESTING DEVICES International Electrotechnical Committee ...

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  IEC 62047-27 : 1ED 2017

  IEC 62047-27 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 27: BOND STRENGTH TEST FOR GLASS FRIT BONDED STRUCTURES USING MICRO-CHEVRON-TESTS (MCT) International Electrotechnical Committee ...

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