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IEC 63068-2:2019 Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Part 2: Test method for defects using optical inspection International Electrotechnical...
IEC 63068-1:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects International Electrotechnical Committee ...
IEC 63055 Ed. 2.0 en:2023 Format for LSI-Package-Board Interoperable design standard by International Electrotechnical Commission , 10/01/2023
IEC 63055 : 1ED 2016 FORMAT FOR LSI-PACKAGE-BOARD INTEROPERABLE DESIGN International Electrotechnical Committee
IEC 63047:2018 Nuclear instrumentation - Data format for list mode digital data acquisition used in radiation detection and measurement International Electrotechnical Committee
IEC 63044-5-3 : 1ED 2017 HOME AND BUILDING ELECTRONIC SYSTEMS (HBES) AND BUILDING AUTOMATION AND CONTROL SYSTEMS (BACS) - PART 5-3: EMC REQUIREMENTS FOR HBES/BACS USED IN INDUSTRIAL ENVIRONMENTS International Electrotechnical Committee ...
IEC 63044-5-2 : 1ED 2017 HOME AND BUILDING ELECTRONIC SYSTEMS (HBES) AND BUILDING AUTOMATION AND CONTROL SYSTEMS (BACS) - PART 5-2: EMC REQUIREMENTS FOR HBES/BACS USED IN RESIDENTIAL, COMMERCIAL AND LIGHT-INDUSTRIAL ENVIRONMENTS International...
IEC 63044-5-1 : 1ED 2017 HOME AND BUILDING ELECTRONIC SYSTEMS (HBES) AND BUILDING AUTOMATION AND CONTROL SYSTEMS (BACS) - PART 5-1: EMC REQUIREMENTS, CONDITIONS AND TEST SET-UP International Electrotechnical Committee ...
IEC 63044-3 : 1ED 2017 HOME AND BUILDING ELECTRONIC SYSTEMS (HBES) AND BUILDING AUTOMATION AND CONTROL SYSTEMS (BACS) - PART 3: ELECTRICAL SAFETY REQUIREMENTS International Electrotechnical Committee
IEC 63044-1 : 1ED 2017 HOME AND BUILDING ELECTRONIC SYSTEMS (HBES) AND BUILDING AUTOMATION AND CONTROL SYSTEMS (BACS) - PART 1: GENERAL REQUIREMENTS International Electrotechnical Committee
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