IEC 61193-1 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Defect registration <br>&nbsp;&nbsp;4.1 Accept criteria<br>&nbsp;&nbsp;4.2 Counting of defects<br>&nbsp;&nbsp;4.3 Post-soldering defect registration <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.3.1 Defects found after testing<br>&nbsp;&nbsp;4.4 Defect subdivision<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.4.1 Defect sources <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.4.2 Defect registration form<br>&nbsp;&nbsp;4.5 Rework immediately prior to soldering<br>&nbsp;&nbsp;4.6 Defect data categories <br>5 Processing the data<br>6 Analysis<br>Annex A (normative) Subprocesses <br>Annex B (informative) Examples of product defect <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;qualification <br>Annex C (informative) Examples of calculations<br>Annex D (informative) Example of registration of defects <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;and processing of the data <br>Figures<br>Tables

Abstract

Describes methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations and can serve as a basis for general quality improvement.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91