SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 23-1: HYBRID INTEGRATED CIRCUITS AND FILM STRUCTURES - MANUFACTURING LINE CERTIFICATION - GENERIC SPECIFICATION
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Standard and preferred values
5 Marking
5.1 Circuit
5.2 Despatch primary pack
6 Quality assessment procedures
6.1 General
6.2 Procedures for manufacturing line certification
6.3 Description of capability
6.4 Qualifying components
6.5 Procedures following the granting of manufacturing
line certification
6.6 Release for delivery
7 Test and measurement procedures
7.1 General
7.2 Standard conditions for testing
7.3 Visual inspections and package dimensions
7.4 Electrical measurement procedures
7.5 Environmental test procedures
Annex A (normative) Product assessment level schedules (PALS)
Annex B (informative) Customer information - Application of
these specifications with particular reference to
produce assessment level schedules (PALS)
Bibliography
Figures
Tables
Applies to high quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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