SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of
bare die and wafers
10 Good practice for automated handling during
assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
