SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Flow soldering equipment
5.2 Reflow soldering equipment
5.3 Pull strength test equipment
5.4 Optical microscope
5.5 Test substrate
5.6 Solder alloy
5.7 Flux for flow soldering
5.8 Solder paste
6 Mounting method
6.1 Flow soldering
6.2 Reflow soldering
7 Test conditions
7.1 Test: Rapid change of temperature
7.2 Pull strength test
8 Test procedure
8.1 Test sequence
8.2 Pre-conditioning
8.3 Initial pull strength measurement
8.4 Rapid change of temperature
8.5 Recovery
8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Pull strength test - Details
Bibliography
Applies to gull-wing lead surface mounting components. It is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
