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IEC 61188-5-8 : 1.0

IEC 61188-5-8 : 1.0

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 General information<br>&nbsp;&nbsp;3.1 General component description<br>&nbsp;&nbsp;3.2 Marking<br>&nbsp;&nbsp;3.3 Carrier packaging format<br>&nbsp;&nbsp;3.4 Process considerations<br>4 BGA (square)<br>&nbsp;&nbsp;4.1 Field of application<br>&nbsp;&nbsp;4.2 Component descriptions<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.2.1 Basic construction <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.2.2 Termination materials <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.2.3 Marking <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.2.4 Carrier package format <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.2.5 Process considerations <br>&nbsp;&nbsp;4.3 Component dimensions (square) <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.3.1 PBGA 1,5 mm pitch component dimensions (square)<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.3.2 PBGA 1,27 mm pitch component dimensions (square) <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.3.3 PBGA 1,00 mm pitch component dimensions (square) <br>&nbsp;&nbsp;4.4 Solder joint fillet design <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.4.1 Solder joint fillet design - Non-collapsing, <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;collapsing (level 3) <br>&nbsp;&nbsp;4.5 Land pattern dimensions <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square) <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square) <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square) <br>5 FBGA (square) <br>6 BGA (rectangular) <br>&nbsp;&nbsp;6.1 Field of application <br>&nbsp;&nbsp;6.2 Component descriptions<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.1 Basic construction <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.2 Termination materials<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.3 Marking <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.4 Carrier package format<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.5 Process considerations<br>&nbsp;&nbsp;6.3 Component dimensions (rectangular)<br>&nbsp;&nbsp;6.4 Solder joint fillet design<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.4.1 Solder joint fillet design - Collapsing (level 3)<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.4.2 Land approximation<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.4.3 Total variation<br>&nbsp;&nbsp;6.5 Land pattern dimensions<br>7 FBGA (rectangular)<br>8 CGA <br>9 LGA<br>Bibliography

Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

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