IEC 62137-1-3 : 1.0

Table of Contents

FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 General remarks<br>5 Test equipment and materials<br>&nbsp;&nbsp;5.1 Reflow soldering oven<br>&nbsp;&nbsp;5.2 Drop impact test equipment<br>&nbsp;&nbsp;5.3 Test substrate<br>&nbsp;&nbsp;5.4 Solder alloy<br>&nbsp;&nbsp;5.5 Solder paste<br>&nbsp;&nbsp;5.6 Specimen components<br>&nbsp;&nbsp;5.7 Strain gauge<br>6 Mounting method<br>7 Test method and procedure, and judgment conditions<br>&nbsp;&nbsp;7.1 Test procedure<br>&nbsp;&nbsp;7.2 Judgment conditions<br>8 Items to be included in the test report<br>9 Items to be given in the product specification<br>Annex A (normative) Drop impact test equipment<br>Annex B (normative) Test method and procedure<br>Annex C (informative) An example of test equipment and <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;procedure<br>Annex D (informative) An example of strain gauge attachment <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;procedure<br>Bibliography

Abstract

Provides solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91