IEC 62418 : 1.0

IEC 62418 : 1.0

SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Test equipment
3 Test structure
4 Stress temperature
5 Procedure
6 Failure criteria
7 Data interpretation and lifetime extrapolation (resistance
  change method)
8 Items to be specified and reported
Annex A (informative) - Stress migration mechanism
Annex B (informative) - Technology-dependent factors for
                        aluminium
Annex C (informative) - Technology-dependent factors for
                        copper
Annex D (informative) - Precautions
Bibliography

Abstract

Specifies a method of metallization stress void test and associated criteria.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47

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