SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop impact test method using test rod
Annex B (informative) - An example of strain gauge attachment
procedure
Pertains to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
