ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Test <br>5 Preconditioning <br>6 Preparation <br>7 Quick heating method<br>8 Synchronous method <br>9 Temperature profile method <br>Annex A (normative) - Equipment for the quick heating <br> and synchronous method <br>Annex B (informative) - Reading of the output data and <br> correction of the result in the quick heating test<br>Annex C (normative) - Test equipment for the temperature <br> profile method<br>Annex D (informative) - Reading of the output data and <br> correction of the result in the temperature<br> profile test<br>Annex E (informative) - Caveats/Notes<br>Bibliography
Gives methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
