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IEC TS 62239-1 : 2.0

IEC TS 62239-1 : 2.0

PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN

International Electrotechnical Committee

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Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
5 Plan administration requirements
Annex A (informative) - Requirement matrix for IEC TS 62239-1
Annex B (informative) - Typical qualification requirements and
        typical component minimum qualification requirements
Annex C (informative) - Semiconductor reliability and wear out
Annex D (informative) - Guidelines for environmental protection
        techniques and for comparison of components specifications
Bibliography

Abstract

Specifies the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 107

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