IEC 63011-1 ED1.0 B:2018

Abstract

This part of IEC 63011 provides definitions pertaining to multichip integrated circuits, asvertically stacked dies using through-silicon vias (TSVs) or micro bumps.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
ProductNote	THIS STANDARD ALSO REFERS TO IEC 63011-3
Pages
ISBN
Committee	TC 47